With the oven set to 11 it reached 250C in around 12 minutes. This is 15C beyond the typical maximum safe temperature for lead-free parts and certainly well beyond the liquidous temperature (219C) of most lead-free solders:
I then attempted a manually controlled profile. I plan to automate my profile, but for now I'll just close the control loop myself to build a few boards. I placed a bityExpress rev A card in the oven with a thermocouple placed near the center of the PCB:
My initial profile attempt was the following:
- Set the oven to 180C and turn it on
- After the temperature has been above 150C for 60 seconds, turn the oven up to its maximum temperature
- After the temperature has been above 220C for 30 seconds, turn the oven off
Comparing this to Altera's SMT Board Assembly Process Recommendations (AN-353-4.0):
- Time preheating (between Ts1 and Ts2): 143 seconds
- spec: 60-120 seconds
- Time above 219C (Ta): 102 seconds
- spec: 60-120 seconds
- Time from ambient to peak temperature: just over 8 minutes
- spec: 8 minutes
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